Next generation lithography has become more difficult with each succeeding dimensional shrink, and a transition to a shorter excitation wavelength, using an extreme ultraviolet (EUV) source is overdue. Unfortunately, the source remains the primary bottleneck; a minimum of 100W will be needed, with 250W for high volume production, to obtain the customary tool throughput. To date, only 30W of source power has been reported. Our speaker will discuss the two main types of EUV sources: one using laser excitation of a metal droplet to form a plasma (LPP), the other using an arc that vaporizes a plasma by a high energy electrical discharge (DPP) or related approaches. He will discuss the shortcomings of each approach. Then he will discuss the laser excitation source in more detail, and go into the engineering problems that need solved to increase the power, increase the system uptime, and bring the source into production.Biography

Dr. Oleg Khodykin holds a doctorate and master degree, both in physics, from Moscow Physical-Technical Institute, Russia. Currently, he is employed at KLA-Tencor , as manager of EUV source development for next generation mask inspection tools. Prior joining KLA-Tencor, he spent 10 years at CYMER , working on experimental development and engineering of EUV source for lithography applications. He currently holds 25 patents related to EUV source development.