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Conference on Electrical Performance of Electronic Packaging and Systems |
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| "The Conference on EPEPS will discuss various rising and complex issues, latest design techniques and modern architectures for design and management electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems; latest CAD concepts, methodologies and algorithms for modeling, simulation and optimization; system-level, board-level and on-chip interconnects; 3D interconnects, 3D packages, TSVs and MCMs; Macro-modeling including model order reduction as it applies to electrical analysis etcetera. The environment at the Conference on EPEPS will let all the participants feel free to ask any kind of assistance and queries regarding the field." |
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| Dates, Times and Locations |
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No upcoming times found for this event |
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